Mirafra presents a paper on Integration of VMM sub modules into OVM – a step by step walkthrough at the 46th DAC in the OVM World booth.
Mirafra completes five years of operation. Mirafra also enters into the fifth year of engagement with a satisfied customer. It has complete ownership of software front-end comprising of, but not limited to, HDL design analysis and elaboration (with integration to a 3rd Party Tool) for the customer - a leader in emulation solutions for hardware verification and hardware-software co-verification.
Mirafra completes tapeout of a mixed signal ultra low power chip for touch screen application . The customer is a leader in capacitive touch sensing solutions, touch screen solutions, powered by Programmable-System-on-Chip technology.
Mirafra adds a market leader in Wireless & CDMA technologies in its client list.
Mirafra starts Implementation team. Along with its already existing strong teams for RTL Design and Verification, Mirafra attains the capabilities to offer end-to-end services in ASIC design from spec-to-silicon under one roof.
75% Engineers from IITs and likes
14 chips on silicon without bugs
8 software components in production
4 engagements > 2 years
2 engagements > 3 years with satisfied customers